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半导体行业专题研究：芯片高性能趋势演进下，玻璃基板有望崭露头角-源达信息
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- 《半导体行业专题研究：芯片高性能趋势演进下，玻璃基板有望崭露头角-源达信息》主要讨论：芯片高性能演进趋势下，玻璃基板优势凸显 玻璃基板的热膨胀系数（CTE）与元器件非常接近，且湿度系数为零，可以用作封装(IC)基板。芯片互联的主要薄弱环节在于界面处和焊接点处，由于不同材料的热膨胀系数…
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- 来源机构：源达信息，篇幅约 11 页。
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