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长江证券-半导体与半导体生产设备行业：景气回暖+Chiplet加速应用，封测行业多重B演绎长期成长逻辑-230527

封装测试产业正处于行业总体景气回升（β1）+先进封装技术价值提升（β2）+AI浪潮驱动行业成（β3）+外部科技限制加速国产化率提升（β4）的多重行业机遇叠加状态，随着晶合集成、中芯集成、颁中科技、汇成股份等晶圆制造、封装测试公司陆续上市，半导体制造整体板块效应逐步强化，封测公司投资机遇凸显，建议重点关注技术水平较强、头部客户资源充沛、现金流&融资能力强扩产能力占优的细分领域头部企业。分析师及联系

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